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HDI Multilayer PCBs have the highest connection density of all PCBs. Typical applications are smartphone, computing and products where size is at a premium.

HDI PCB stands for High-Density Interconnect Printed Circuit Board. It is a type of printed circuit board designed to accommodate high-density electronic components and interconnections in a compact space. HDI PCBs are similar to Multilayer PCBs, however they use advanced technologies to achieve finer lines and smaller vias. They can also use extra fine track size/spacing and laser-drilled microvias to maximize the connections, allowing for increased component density.

HDI PCBs are commonly used in various high-tech applications, including smartphones, tablets, medical devices, and other portable electronic devices. The demand for HDI technology has grown with the increasing need for smaller and more powerful electronic devices in the electronics industry.

Speak with our experts today to discuss how a High-Density Interconnect PCB can meet and exceed your project requirements. Contact us



Technical Specification

Number of Layers



FR4, FR4 Halogen Free, FR4 High Performance, FR4 High Speed, Rogers, Taconic

Base Copper Thickness

Ø.33oz (12μm) through to 12oz (42Øμm)

Finished PCB Thickness

Ø.4 – 8.Ømm

Minimum track width & spacing

3/3mil (Ø.Ø75/Ø.Ø75mm)

Impedance Control

+/- 7%

Min Via Hole Size

Ø.Ø75mm (3 mil)

Maximum No HDI Steps


Surface Finishes

HASL, Lead Free HASL, Immersion Tin, Immersion Silver, OSP, ENIG(gold), Hard gold fingers

Other Finishes/Technologies

Carbon printing, Peelable mask, 2D bar coding. Aluminium bonding

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